24 April 2025, Hong Kong Chu Hai College and Huawei International Co. Limited formally signed a Memorandum of Understanding (MoU) on strategic cooperation, marking a significant step forward in the fields of education and technological innovation for both parties.

Huawei was founded in 1987 and is a global leader in ICT (information and communications technology) infrastructure and smart devices. It is committed to bringing the digital world to every person, home and organization for a fully connected, intelligent world.

At the signing ceremony, the Vice President (Administration) of Hong Kong Chu Hai College Mr. Chen Liang Yong expressed the college’s honor in establishing a strategic partnership with a technology leader like Huawei. He noted that the college had previously used Huawei’s products in certain projects and was deeply impressed by their outstanding performance and commitment to the education sector. This collaboration will focus on exploring new talent development models, establishing a high-level ICT training base, and providing students with more internship and employment opportunities, thereby enhancing the college’s educational quality and talent cultivation for society.

The Huawei representative emphasized that the partnership will center on two key areas: innovative talent development and AI smart campus construction. Huawei will fully support Hong Kong Chu Hai College in advancing majors such as cloud computing, big data, IoT, and AI, while assisting in the top-level planning of an AI smart campus, jointly driving the digital and intelligent transformation of education.

Building on this, both parties plan to integrate Huawei's high-quality internal training resources into the teaching system by offering specialized elective courses at Hong Kong Chu Hai College. This initiative will not only broaden students' academic credit pathways but also enable them to systematically master cutting-edge IT technologies, thereby significantly enhancing their professional competencies and practical skills.

The signing of this MoU lays a solid foundation for future in-depth collaboration. Both parties look forward to further strengthening exchanges in education and technological innovation, injecting new vitality into Hong Kong’s ICT industry and talent ecosystem.